application:
Move in line with the rapid development of microelectronics has advanced the production of printed
circuit boards in a direction of multi-layer technology, integration and functionalization far.
Meet the demands for high-end copper plating, coating does not meet the vertical, such as high aspect
ratios, Deep, blind via and PCB horizontal pulse plating. Our high purity copper powder contains small
impurities and is extremely stable. It can guarantee the purity of the copper plating solution by
compensating ions rapidly and consistently.
Features:
Toxic, irritating, Relative Density: 6.32 (powder), insoluble in water, soluble in weak acid;
advantages:
First Our advanced manufacturing techniques ensures that our product has a high copper content, low
organic
Impurities and chloride, which guarantees high stability.
Second Our unique drying technique produces subtle crystals with a high rate of dissolution without
bubbling effect.
Third It can be directly used in the supplementation of copper salts in the production. There’s no
need to deal with the contaminants, it ensures economization and stability in the horizontal copper
plating
Copper(II) oxide powder Suppliers,Copper(II) oxide powder Sale from KFO
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